document number: 94108 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 01-jul-09 1 surface mountable fast soft recovery diode, 8 a 8ewf..spbf soft recovery series vishay high power products features/description the 8ewf..spbf fast soft recovery rectifier series has been optimized for combined short reverse recovery time, low forward voltage drop and low leakage current. the glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions. this series is designed and qualified for industrial level. compliant to rohs directive 2002/95/ec. applications ? output rectification and free wheeling diode in inverters, choppers and converters ? input rectifications where se vere restrictions on conducted emi should be met product summary v f at 8 a < 1.2 v t rr 55 ns v rrm 200 to 600 v base common cathode + 3 anode 2 1 anode -- d-pak major ratings and characteristics symbol characteristics values units i f(av) sinusoidal waveform 8 a v rrm 200 to 600 v i fsm 170 a v f 8 a, t j = 25 c 1.2 v t rr 1 a, 100 a/s 55 ns t j range - 40 to 150 c voltage ratings part number v rrm , maximum peak reverse voltage v v rsm , maximum non-repetitive peak reverse voltage v i rrm at 150 c ma 8ewf02spbf 200 300 3 8ewf04spbf 400 500 8ewf06spbf 600 700 absolute maximum ratings parameter symbol test conditions values units maximum average forward current i f(av) t c = 96 c, 180 conduction half sine wave 8 a maximum peak one cycle non-repetitive surge current i fsm 10 ms sine pulse, rated v rrm applied 170 10 ms sine pulse, no voltage reapplied 200 maximum i 2 t for fusing i 2 t 10 ms sine pulse, rated v rrm applied 140 a 2 s 10 ms sine pulse, no voltage reapplied 200 maximum i 2 t for fusing i 2 t t = 0.1 ms to 10 ms, no voltage reapplied 2000 a 2 s
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94108 2 revision: 01-jul-09 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a note (1) when mounted on 1" square (650 mm 2 ) pcb of fr-4 or g-10 materi al 4 oz. (140 m) copper 40 c/w for recommended footprint and soldering techniques refer to application note #an-994 electrical specifications parameter symbol test conditions values units maximum forward voltage drop v fm 8 a, t j = 25 c 1.2 v forward slope resistance r t t j = 150 c 16 m threshold voltage v f(to) 1.13 v maximum reverse leakage current i rm t j = 25 c v r = rated v rrm 0.1 ma t j = 150 c 3 recovery characteristics parameter symbol test conditions values units reverse recovery time t rr i f at 8 apk 25 a/s t j = 25 c 140 ns reverse recovery current i rr 2.6 a reverse recovery charge q rr 0.25 c snap factor s 0.5 i fm t rr di dt i rr q rr t t a t b thermal - mechanical specifications parameter symbol test conditions values units maximum junction and storage temperature range t j , t stg - 40 to 150 c soldering temperature t s for 10 seconds 240 maximum thermal resistance, junction to case r thjc dc operation 2.5 c/w typical thermal resistance, junction to ambient (pcb mount) r thja (1) 50 approximate weight 1g 0.03 oz. marking device case style to-252aa (d-pak) 8ewf06s
document number: 94108 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 01-jul-09 3 8ewf..spbf soft recovery series surface mountable fast soft recovery diode, 8 a vishay high power products fig. 1 - current ra ting characteristics fig. 2 - current rating characteristics fig. 3 - forward powe r loss characteristics fig. 4 - forward power loss characteristics fig. 5 - maximum non-repetitive surge current fig. 6 - maximum non-repetitive surge current 60 70 80 90 100 110 120 130 140 150 0123456789 30 60 90 120 180 maximum allowable case temperature (c) conduction angle average forward current (a) 8ewf..s series r (dc) = 2.5 c/ w thjc 70 80 90 100 110 120 130 140 150 02468101214 dc 30 60 90 120 180 maximum allowable case temperature (c) conduction period average forward current (a) 8ewf..s se ries r (dc) = 2.5 c/ w thjc 0 2 4 6 8 10 12 0123456789 rm s li m i t 180 120 90 60 30 conduction angle average forward current (a) maximum average forward power loss (w) 8ewf..s series t = 150c j 0 2 4 6 8 10 12 14 16 02468101214 dc 180 120 90 60 30 rm s li m i t conduction period average forw ard current (a) maximum average forward power loss (w) 8ewf..s se ries t = 1 5 0 c j 50 75 100 125 150 175 200 110100 number of equal amplitude half cycle current pulses (n) peak half sine wave forward current (a) init ia l t = 150c @ 60 hz 0.0083 s @ 50 hz 0.0100 s j 8 ew f. . s se r i e s at any rated load condition and with rated v applied following surge. rrm 40 60 80 100 120 140 160 180 200 0.01 0.1 1 pu l se tra i n d ur a t i o n (s) peak half sine wave forward current (a) versus pulse train duration. init ial t = 150c no vo lta g e rea p p lied ra t e d v re a p p l i e d rrm j maximum non repetitive surge current 8 ew f. . s se r i e s
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94108 4 revision: 01-jul-09 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a fig. 7 - forward voltage drop characteristics fig. 8 - recovery time characteristics, t j = 25 c fig. 9 - recovery time characteristics, t j = 150 c fig. 10 - recovery char ge characteristics, t j = 25 c fig. 11 - recovery char ge characteristics, t j = 150 c fig. 12 - recovery current characteristics, t j = 25 c 1 10 100 0.5 1 1.5 2 2.5 3 t = 2 5 c j instantaneous forward current (a) in st a n t a n e o u s fo r w a r d v o l t a g e ( v ) t = 1 5 0 c j 8ewf..s series 0 0.1 0.2 0.3 0.4 04080120160200 rate of fall of forward current - di/dt (a/s) 1 a 5 a 10 a ma ximum re ve rse re c o ve ry time - trr (s) 8ewf..s se ries t = 2 5 c j i = 20 a fm 8 a 2 a 0 0.1 0.2 0.3 0.4 0 40 80 120 160 200 ra t e of fa ll of fo rw a rd curre n t - d i/ d t (a/ s) 1 a 5 a 10 a maximum reverse recovery time - trr (s) 8ewf..s series t = 150 c j i = 20 a fm 2 a 8 a 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 40 80 120 160 200 ra t e of fa ll of fo rw a rd curre nt - d i/ d t (a/ s) 1 a 5 a 10 a maximum reverse recovery charge - qrr (c) 8ewf..s series t = 25 c i = 20 a fm 2 a j 8 a 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 40 80 120 160 200 rate of fall of forward current - di/dt (a/s) 1 a 5 a 10 a ma ximum re verse rec overy charg e - qrr (c) 8 ew f. . s se r i e s t = 1 5 0 c j i = 20 a fm 2 a 8 a 0 2 4 6 8 10 12 14 16 04080120160200 ma ximum reverse re c overy current - irr (a) rate of fall of forward current - di/ dt (a/ s) 1 a 5 a 10 a 8 ew f. . s se r i e s t = 2 5 c j i = 20 a fm 2 a 8 a
document number: 94108 for technical questions, contact: diodestech@vishay.com www.vishay.com revision: 01-jul-09 5 8ewf..spbf soft recovery series surface mountable fast soft recovery diode, 8 a vishay high power products fig. 13 - recovery current characteristics, t j = 150 c fig. 14 - thermal impedance z thjc characteristics 0 2 4 6 8 10 12 14 16 18 20 04080120160200 maximum reverse re c ove ry current - irr (a) rate of fall of forward current - di/dt (a/s) 1 a 5 a 10 a 8 ew f . . s se r i e s t = 150 c i = 20 a fm 2 a j 8 a 0.1 1 10 1 . 0 1 0 . 0 1 0 0 . 0 1 0 0 0 . 0 square wave pulse duration (s) st e a d y st a t e v a l u e (dc operation) sing le pulse thjc 8ewf..s series d = 0.50 d = 0.33 d = 0.25 d = 0.17 d = 0.08 transient thermal impedance z (c/w)
www.vishay.com for technical questions, contact: diodestech@vishay.com document number: 94108 6 revision: 01-jul-09 8ewf..spbf soft recovery series vishay high power products surface mountable fast soft recovery diode, 8 a ordering information table 1 - current rating (8 = 8 a) 2 - circuit configuration: e = single diode 3 - package: w = d-pak 4 - type of silicon: f = fast soft recovery rectifier 5 - voltage code x 100 = v rrm 6 - s = surface mountable 7 - tr = tape and reel trr = tape and reel (right oriented) trl = tape and reel (left oriented) - pbf = lead (pb)-free 8 02 = 200 v 04 = 400 v 06 = 600 v device code 5 13 24 678 8 e w f 06 s tr pbf links to related documents dimensions www.vishay.com/doc?95016 part marking information www.vishay.com/doc?95059 packaging information www.vishay.com/doc?95033
document number: 95016 for technical questions concer ning discrete products, cont act: diodes-tech@vishay.com www.vishay.com revision: 04-nov-08 for technical qu estions concerning module products , contact: ind-modules@vishay.com 1 d-pak (to-252aa) outline dimensions vishay high power products notes (1) dimensioning and toleranci ng as per asme y14.5m-1994 (2) lead dimension uncontrolled in l5 (3) dimension d1, e1, l3 and b3 establish a mi nimum mounting surface for thermal pad (4) section c - c dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip (5) dimension d, and e do not include mold flash. mold flash shall not exceed 0.127 mm (0. 005") per side. these dimensions are meas ured at the outermost extremes of the plastic body (6) dimension b1 and c1 applied to base metal only (7) datum a and b to be determined at datum plane h (8) outline conforms to jedec outline to-252aa dimensions in millimeters and inches symbol millimeters inches notes symbol millimeters inches notes min. max. min. max. min. max. min. max. a 2.18 2.39 0.086 0.094 e 2.29 bsc 0.090 bsc a1 - 0.13 - 0.005 h 9.40 10.41 0.370 0.410 b 0.64 0.89 0.025 0.035 l 1.40 1.78 0.055 0.070 b2 0.76 1.14 0.030 0.045 l1 2.74 bsc 0.108 ref. b3 4.95 5.46 0.195 0.215 3 l2 0.51 bsc 0.020 bsc c 0.46 0.61 0.018 0.024 l3 0.89 1.27 0.035 0.050 3 c2 0.46 0.89 0.018 0.035 l4 - 1.02 - 0.040 d 5.97 6.22 0.235 0.245 5 l5 1.14 1.52 0.045 0.060 2 d1 5.21 - 0.205 - 3 ? 0 10 0 10 e 6.35 6.73 0.250 0.265 5 ?1 0 15 0 15 e1 4.32 - 0.170 - 3 ?2 25 35 25 35 ? 1 e (5) b 3 (3) 0.010 cab l3 (3) b a c h c l2 d (5) l4 b 2 x e b 2 (2) l5 1 2 3 4 ? 2 a c2 a a h seating plane c detail ?c? (7) seating plane a1 detail ?c? rotated 90 cw scale: 20:1 (l1) c c l ? ga u ge plane lead tip m 0.010 cab m 32 4 1 e1 d1 mi n . 0.265 (6.74) mi n . 0.245 (6.23) mi n . 0.0 8 9 (2.2 8 ) mi n . 0.06 (1.524) 0.4 88 (12.40) 0.409 (10.40) 0.093 (2.3 8 ) 0.0 8 5 (2.1 8 ) pad layout
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